3U VPX FPGA MODULE · SKU 90075345
XPedite2770
The XPedite2770 is a high-performance, reconfigurable, conduction-cooled, 3U VPX processing module based on the AMD Versal™ Prime Adaptive Compute Acceleration Platform (ACAP).
With multiple high-speed fabric interfaces and 16 GB of LPDDR4 ECC SDRAM in two channels, the XPedite2770 is ideal for customizable, high-bandwidth, signal-processing applications.
Product Lifecycle
X-ES also offers comprehensive configuration and obsolescence management services, providing customers with direct control over non-interchangeable changes and extending product availability and serviceability well beyond standard end-of-life milestones.
Engineered for Extended Reliability
All X-ES products are designed and manufactured 100% in the USA with components from trusted supply chains in order to deliver rugged, reliable performance in the most demanding environments.
Built with components rated for extreme conditions and validated through rigorous testing, our solutions minimize obsolescence risk and lower total cost of ownership across the full program lifespan.
Introduction to XPedite2770
The XPedite2770 is a high-performance, reconfigurable, conduction-cooled, 3U VPX processing module based on the AMD Versal™ Prime Adaptive Compute Acceleration Platform (ACAP). With multiple high-speed fabric interfaces and 16 GB of LPDDR4 ECC SDRAM in two channels, the XPedite2770 is ideal for customizable, high-bandwidth, signal-processing applications.
Security & Data Protection
It integrates SecureCOTS™ technology with a Versal™ Prime VM1402 ACAP for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.
SOSA Alignment
The XPedite2770 offers a SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16 and is designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C-(P3F)(P2F)(2E7-E3)(N-N-N-N-M3/M4/M5-N)
Heterogeneous Compute
The XPedite2770 is a heterogeneous compute platform that delivers exceptional performance utilizing two ARM® Cortex®-A72 processor cores, two ARM® Cortex®-R5F real-time processor cores, a Network-on-Chip (NoC) interconnect, and a large FPGA fabric.
These devices provide specialized processing elements designed to meet the demands of high-bandwidth applications such as packet processing, signal processing, sensor I/O, DSP-intensive applications, next-generation wired and 5G wireless infrastructure, cloud computing, and aerospace and defense applications.
I/O & Connectivity
Providing incredible speed with two x4 and two x1 High-Speed Serial (HSS) 25 Gbps-capable interfaces, plus two 1000BASE-T Ethernet ports, the XPedite2770 accommodates up to 256 GB of onboard NAND flash in addition to numerous I/O ports, including LVDS, single-ended GPIO, and RS-232/422/485 serial through the backplane connectors.
The XPedite2770 provides additional expansion capabilities by including an integrated XMC site, which includes one x8 HSS 16 Gbps-capable connection to the Versal™ Prime ACAP and X12d I/O mapped directly to the VPX backplane connectors. Additional configurations can route x16s and x8d from the XMC site to the VPX backplane connectors.
Development Support
The XPedite2770 provides a high-performance, feature-rich solution capable of interfacing to and processing streaming data from a wide variety of sensors. The X-ES Hardware Manager Development Kit (HMDK) is provided to deliver a pre-validated environment for rapid application development, offering an optimized library of IP, design resources, and software components that can easily be used as the basis for custom designs.
X-ES’ HMDK includes the Hardware Manager application, Arm Trusted Firmware (ATF), U-Boot bootloader, and the FPGA Development Kit (FDK), and complete example designs for the XPedite2770. Linux Yocto support is also available separately.
FPGA
- AMD (formerly Xilinx) Versal™ Prime VM1402 ACAP for high-performance logic and DSP applications
- Dual-core ARM® Cortex®-A72, 48 KB/32 KB L1 cache with parity and ECC; 1 MB L2 cache with ECC
- Dual-core ARM® Cortex®-R5F, 32 KB/32 KB L1 cache, and 256 KB TCM with ECC
- One coherent PCI Express module (CPM) to support PCIe with acceleration features such as CCIX
- Two integrated MRMAC blocks supporting 100 Gigabit-capable Ethernet functions
- Two integrated PLPCIe Gen4 blocks supporting PCI Express functions
Memory
- 16 GB of LPDDR4 ECC SDRAM in two channels
- One channel can be reconfigured as 16 GB non-ECC SDRAM for higher performance and capacity (24 GB total)
- Up to 256 GB of NAND flash
- 4 Gbit of QSPI FPGA configuration flash
XMC Site
- One x8 High-Speed Serial (HSS) 16 Gbps-capable interface to support PCI Express
VPX (VITA 46) P0 I/O
- Two IPMB connections to an IPMI controller
VPX (VITA 46) P1 I/O
- Two x1 HSS 25 Gbps-capable interfaces to support 25GBASE-R Ethernet
- One x4 HSS 25 Gbps-capable interface on P1.A to support Ethernet, CPM, PCIe, etc.
- One x4 HSS 25 Gbps-capable interface on P1.B to support Ethernet, PCIe, etc.
- P1.A and P1.B ports can be combined to function as one x8 CPM PCI Express port
- XMC P16 I/O, mapping P1w9-X12d per VITA 46.9
VPX (VITA 46) P2 I/O
- Two 1000BASE-T Ethernet ports
- Build option for six LVDS GPIO (XPIO)
- One x1 HSS 8 Gbps-capable interface to support PCIe and SATA
- One RS-232/422/485 serial port
- Build option for eight LVDS (XPIO) and 16 single-ended GPIO (HDIO) from the FPGA, or XMC P16 I/O mapping P2w9-X16s+X8d
- Three single-ended GPIO (MIO)
Development Support
- Linux Yocto support
- Hardware Manager Development Kit (HMDK)
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16
- Designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C-(P3F)(P2F)(2E7-E3)(N-N-N-N-M3/M4/M5-N)<XA0>
- Dimensions: 100 mm x 160 mm
- 0.8 in. pitch without solder-side cover
- 0.85 in. and 1.0 in. pitch with solder-side cover and Two-Level Maintenance (2LM) support
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
- Conformal coating available as an ordering option
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Accessories
- XIt1170 (90040115) – 3U VPX Rear Transition Module with Gigabit Ethernet, High-Speed Serial, and XIM Site
XPedite2770
AMD (formerly Xilinx) Versal™ Prime VM1402 ACAP-Based 3U VPX FPGA Module with 16 GB of LPDDR4, PCIe Gen3, and SecureCOTS™
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Datasheet
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Technical Documentation
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