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Extreme Engineering Solutions (X-ES) is Now Shipping XPand1300 and XPand1200: 3U VPX / cPCI Air-Cooled and Conduction-Cooled Module Development Systems

Extreme Engineering Solutions (X-ES) is the first to ship OpenVPX™ compliant 3U development systems: XPand1200, a development platform for conduction-cooled modules, and XPand1300, a development platform for air-cooled modules. Both are designed to support a minimum of ten 0.8 in. or 1.0 in. pitch slots and built in accordance with OpenVPX™ design principles.

XPand1200: Conduction-Cooled Development System – featuring rapid I/O configuration via RTM modules, Star PCIe and Gigabit Ethernet topologies, and including PCIe and Gigabit Ethernet switch. The XPand1200 supports up to 550 W of total simultaneous power delivery and a thermal dissipation of up to 50 W per slot. Weighing 38 lbs (including backplane and power supply) and measuring 8.5″ (H) x 11″ (W) x 13″ (L), the XPand1200 is designed to make the path from conduction-cooled development to deployment effortless.

XPand1300: Air-Cooled Development System – featuring rapid I/O configuration via RTM modules, removable side covers for debug access, Star PCIe and Gigabit Ethernet topologies, and including PCIe and Gigabit Ethernet switch. Up to 20 CFM of air-flow is provided per slot as well as 550 W of total simultaneous power delivery. The XPand1300 provides the system developer maximum performance and flexibility; weighing only 19 lbs (including backplane and power supply) and measuring 13.5″ (H) x 13.5″ (W) x 11.6″ (L).

System Components – The XPand1200-1 and XPand1300-1 system configurations come standard with backplane, switch and RTM for $9,995:

  • XTend4130: Development backplane with centralized switching and leaf node support
  • XChange3012: PCIe and Gigabit Ethernet switch with XMC and management support
  • XIt3012: RTM for XChange3012 with DB-9 and two RJ-45 connectors

XPand1200 and XPand1300 can be coupled with high-performance, low-power 3U VPX or cPCI X-ES single board computers (SBC), storage, I/O, and companion RTMs, such as:

  • XPedite7170: Intel® Core™2 Duo processor based 3U VPX SBC
  • XPedite5370: NXP (formerly Freescale) dual-core MPC8572E PowerQUICC™ III processor based 3U VPX SBC
  • XPedite5170: NXP (formerly Freescale) dual-core MPC8640D (with AltiVec) processor based 3U VPX SBC
  • XPedite7130: Intel® Core™2 Duo processor based 3U cPCI SBC
  • XPedite5130: NXP (formerly Freescale) dual-core MPC8640D (with AltiVec) processor based 3U cPCI SBC
  • XPedite5330: NXP (formerly Freescale) dual-core MPC8572E PowerQUICC® III processor based 3U cPCI SBC
  • XPort6170: 3U VPX Removable SATA Solid State Drive (SSD) Solution
  • XPm2000: MIL-STD-704 28 V input to ±12 V, 5 V, and 3.3 V output power supply
  • XIt1070: RTM for X-ES processor SBCs

“Our customers have asked for a rapid software and hardware evaluation system,” states Ben Klam, VP of Engineering. “The XPand Series of development systems exceed this requirement by allowing production modules to be used in a cost-effective evaluation and demonstration setting,” Mr. Klam adds.

Pricing and Availability – The XPand1200-1 and XPand1300-1 system configurations are available now for $9,995, including backplane, switch and RTM. Each system has been designed with the flexibility to accommodate unique I/O requirements with standards based products. Please contact X-ES to discuss a solution that will meet and exceed your processing, I/O and power requirements.

About X-ES

Extreme Engineering Solutions, Inc. (X-ES), a 100% U.S.A.-based company, designs and builds single-board computers, I/O boards, power supplies, backplanes, chassis, and system-level solutions for embedded computing customers. X-ES offers cutting-edge performance and flexibility in design, plus an unparalleled level of customer support and service.

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