Products
Overview
Showing 271–285 of 340 results
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XPort3300
Status: End of Life (EOL)
Form Factor: XMC
Ethernet: 2 SFP+Air-Cooled XMC with Dual 10 Gigabit Ethernet SFP+ Interfaces
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XPort3200
Status: End of Life (EOL)
Form Factor: PMC, XMC
Ethernet: 2 10/100/1000BASE-T
Serial: 2 RS-232/422/485Freescale QorIQ P1020 Processor-Based Conduction- or Air-Cooled XMC/PMC IEEE 1588v2 Grandmaster Clock Module
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XPm2010
Form Factor: 3U cPCI
Input Voltage: MIL-STD-704 28 VDC
Max Output Power: 300 W
Max Current on 12 V: 8.3 A
Max Current on 5 V: 22 A
Max Current on 3.3 V: 25 A
Max Current on -12 V: 2 AMIL-STD-704 28 V Input to ±12 V, 5 V, and 3.3 V Output 3U PICMG 2.11 Power Supply with Integrated MIL-STD-461E Filtering
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XPand9001
Status: End of Life (EOL)
Form Factor: Custom
Chassis Type: Custom
Number of Slots: 1
Dimensions: 5.8"L x 3.5"W x 1.1"H
Chassis Cooling: Natural Convection-CooledXPort6192 Solid-State Drive (SSD) Module Development System
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XPand1303
Status: End of Life (EOL)
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.6"L x 13.5"W x 13.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Air-Cooled Modules
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XPand1301
Status: End of Life (EOL)
Form Factor: 3U cPCI
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.6"L x 13.5"W x 13.5"H
Chassis Cooling: Forced Convection-Cooled3U CompactPCI Development Platform for Up to Eight Air-Cooled Modules
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XPand1300
Status: End of Life (EOL)
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.6"L x 13.5"W x 13.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Air-Cooled Modules
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XPand1202
Status: End of Life (EOL)
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module
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XPand1201
Status: End of Life (EOL)
Form Factor: 3U cPCI
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules
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XPand1200
Status: End of Life (EOL)
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
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XPand1030
Status: End of Life (EOL)
Form Factor: 3U cPCI
Chassis Type: Development
Number of Slots: 2
Dimensions: 8.3"L x 4.2"W x 8.5"H
Chassis Cooling: Forced Convection-Cooled3U cPCI Two-Slot Conduction-Cooled Development Platform for Cisco® 5940
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XPand1011
Status: End of Life (EOL)
Form Factor: 6U VPX
Chassis Type: Development
Number of Slots: 2
Dimensions: 17.5"L x 5.6"W x 9.3"H
Chassis Cooling: Forced Convection-CooledTwo-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
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XPand1010
Status: End of Life (EOL)
Form Factor: 6U VPX
Chassis Type: Development
Number of Slots: 2
Dimensions: 13.6"L x 4.2"W x 8.5"H
Chassis Cooling: Forced Convection-Cooled6U VPX Two-Slot Conduction-Cooled Development System
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XPm2000
Status: End of Life (EOL)
Form Factor: 3U cPCI
Input Voltage: MIL-STD-704 28 VDC
Max Output Power: 200 W
Max Current on 12 V: 8.3 A
Max Current on 5 V: 20 A
Max Current on 3.3 V: 25 A
Max Current on -12 V: 2 AMIL-STD-704 28 V Input to ±12 V, 5 V, and 3.3 V Output 3U Power Supply with Integrated MIL-STD-461E Filtering
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XPedite5301
Status: End of Life (EOL)
Form Factor: PMC, XMC
Processor: NXP PowerQUICC™ III MPC8572E
Memory: 2 GB DDR2
Ethernet: 3 10/100/1000BASE-T
Serial: 1 RS-232, 2 RS-232/422/485NXP PowerQUICC™ III MPC8572E Dual-Core Processor-Based Conduction-Cooled XMC/PMC Module