XPedite7680

Intel® Xeon® D-1500 Family Processor-Based 3U VPX-REDI Module with Dual 10 Gigabit Ethernet and XMC Site

Providing up to 16 Xeon®-class cores, up to 32 GB of DDR4-2133 ECC SDRAM, and XMC support, the XPedite7680 is an optimal choice for computationally heavy applications requiring maximum data and information protection.

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XPedite7680 | 3U VPX Single Board Computer
XPedite7680 | 3U VPX Single Board Computer Top ShotXPedite7680 | 3U VPX Single Board Computer Bottom Shot

The XPedite7680 is a high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D-1500 family processors (formerly Broadwell-DE). The Intel® Xeon® D processor can provide up to 16 Xeon®-class cores in a single, power-efficient System-on-Chip (SoC) package. The XPedite7680 maximizes network performance with two 10 Gigabit Ethernet ports configured as 10GBASE-KR and one Gigabit Ethernet port configured as 10/100/1000BASE-T.

Up to eight lanes of PCI Express Gen3 are routed to the backplane P1 connector, supporting a single x8 PCIe interface or two x4 PCIe interfaces. This interface also supports Non-Transparent Bridging, enabling direct communication with other Intel® processors, and there is no need for a separate switch module in the system, further reducing SWaP-C for the system integrator.

The XPedite7680 provides superior growth and expansion capabilities through an XMC site, while maintaining a 0.8 in. VPX slot pitch (12-core processor configurations require 1.0 in. pitch). This gives system integrators a plethora of COTS options for additional I/O, storage, or processing.

The XPedite7680 accommodates up to 32 GB of DDR4 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7680 also hosts numerous I/O ports, including USB, SATA, and RS-232/422/485 serial through the backplane connectors. Wind River VxWorks and X-ES Enterprise Linux Support Packages (XEL) are available.

Features

  • Supports Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
  • Up to 16 Xeon®-class cores in a single, power-efficient SoC package
  • 4, 8, or 12 core SKUs available with native extended temperature support
  • 3U VPX (VITA 46) module
  • Optional VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)
  • Compatible with multiple VITA 65 OpenVPX™ slot profiles
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • Conduction- or air-cooled
  • Up to 32 GB of DDR4 ECC SDRAM in two channels
  • Up to 32 GB of SLC NAND flash
  • XMC interface with a x8 PCIe interface and rear I/O support
  • One x8 or two x4 PCI Express backplane fabric interconnects
  • Two 10GBASE-KR Ethernet ports
  • One Gigabit Ethernet port
  • Two USB 2.0 ports
  • One RS-232/422/485 serial port
  • Two SATA ports
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Technical Specs

Processor

  • Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
  • Up to 16 Xeon®-class cores in a single, power-efficient SoC package
  • 4, 8, or 12 core SKUs available with native extended temperature support

Memory

  • Up to 32 GB of DDR4 ECC SDRAM in two channels
  • Up to 32 GB of NAND flash
  • 32 MB NOR boot flash
  • 64 kB EEPROM

VPX (VITA 46) P0 I/O

  • VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)
  • 1 Pulse Per Second (1PPS)

VPX (VITA 46) P1 I/O

  • x4 PCI Express Gen3-capable interface to P1.A
  • x4 PCI Express Gen3-capable interface to P1.B
  • Two 10GBASE-KR Ethernet ports
  • XMC P16 I/O, mapping P1w9-X12d per VITA 46.9
  • 3.3 V GPIO signals

VPX (VITA 46) P2 I/O

  • One 10/100/1000BASE-T Gigabit Ethernet port
  • Two SATA ports capable of 6 Gb/s
  • Two USB 2.0 ports
  • One RS-232/422/485 serial port

XMC Site

  • x8 PCI Express Gen3-capable interface
  • X12d P16 I/O

Additional Features

  • Non-volatile memory write protection
  • Optional Trusted Platform Module (TPM 2.0)
  • IEEE 1588 support on one Gigabit Ethernet port

Software Support

  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover (optional)
  • 1.0 in. pitch with Two-Level Maintenance (2LM) support

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
  • Conformal coating available as an ordering option
  • Thermal performance will vary based on CPU frequency and application
  • Contact X-ES for air-cooled development options

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

  • XIt1085 (90040045) - 3U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and DisplayPort
  • XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
  • XPand1200 (90070530) - 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
  • XPand1203 (90072665) - 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
  • XTend218 (90072500) - Debug Module/Cable with Serial/I²C/USB/JTAG/SPI and Power Supply Programming

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

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Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Webinar

Intel® Xeon® D in High Performance Computing

View Presentation

Board Support

X-ES Enterprise Linux (XEL) Board Support Package

View BSP

Product Family

View an Intel® Xeon® D 3U VPX SBCs Family Comparison

View Comparison

Datasheet

View the XPedite7680
Datasheet PDF

Download Datasheet

3U VPX SBCs

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