3U VPX SINGLE BOARD COMPUTER · SKU 90030420
XPedite7670
Not Recommended for New Designs
Contact X-ES Sales for assistance with choosing a recommended replacement product.
The XPedite7670 is a high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D processor.
The XPedite7670 accommodates up to 16 GB of DDR4 ECC SDRAM in two channels to support memory-intensive applications.
Product Lifecycle
X-ES also offers comprehensive configuration and obsolescence management services, providing customers with direct control over non-interchangeable changes and extending product availability and serviceability well beyond standard end-of-life milestones.
Engineered for Extended Reliability
All X-ES products are designed and manufactured 100% in the USA with components from trusted supply chains in order to deliver rugged, reliable performance in the most demanding environments.
Built with components rated for extreme conditions and validated through rigorous testing, our solutions minimize obsolescence risk and lower total cost of ownership across the full program lifespan.
Introduction to XPedite7670
The XPedite7670 is a high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D-1500 family processors (formerly Broadwell-DE). The Intel® Xeon® D processor can provide up to 16 Xeon®-class cores in a single, power-efficient System-on-Chip (SoC) package.
Network Performance
The XPedite7670 maximizes network performance with two 10 Gigabit Ethernet ports configured as 10GBASE-KR and two Gigabit Ethernet ports configured as 10/100/1000BASE-T.
Backplane Connectivity
Up to eight lanes of PCI Express Gen3 are routed to the backplane P1 connector, supporting a single x8 PCIe interface or two x4 PCIe interfaces.
This interface also supports Non-Transparent Bridging, enabling direct communication with other Intel® processors, and there is no need for a separate switch module in the system, further reducing SWaP-C for the system integrator.
Memory & I/O
The XPedite7670 accommodates up to 16 GB of DDR4 ECC SDRAM in two channels to support memory-intensive applications.
The XPedite7670 also hosts numerous I/O ports, including USB, SATA, and RS-232/422/485 serial through the backplane connectors.
Expansion Capabilities
The XPedite7670 provides superior growth and expansion capabilities by including an XMC site with full 10 mm I/O envelope support, while maintaining a 0.8 in. VPX slot pitch (12-core processor configurations require 1.0 in. pitch).
This gives system integrators a plethora of COTS options for additional I/O, storage, or processing.
Software & Boot Support
Wind River VxWorks, X-ES Enterprise Linux (XEL), and Linux Yocto Board Support Packages (BSPs) are available.
The XPedite7670 uses coreboot, powered by Intel®’s Firmware Support Package (FSP), to provide fast boot times and significantly simplify code traceability over legacy BIOS implementations.
Processor
- Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
- Up to 16 Xeon®-class cores in a single, power-efficient SoC package
- 4, 8, or 12 core SKUs available with native extended temperature support
Memory
- Up to 16 GB of DDR4 ECC SDRAM in two channels
- Up to 32 GB of NAND flash
- 32 MB NOR boot flash
- 64 kB EEPROM
VPX (VITA 46) P0 I/O
- Two IPMB connections to optional IPMI Controller (IPMC)
VPX (VITA 46) P1 I/O
- x4 PCI Express Gen3-capable interface to P1.A
- x4 PCI Express Gen3-capable interface to P1.B
- Two 10GBASE-KR Ethernet ports
- XMC P16 I/O, mapping P1w9-X12d per VITA 46.9
VPX (VITA 46) P2 I/O
- Two 10/100/1000BASE-T Gigabit Ethernet ports
- Up to six SATA ports capable of 6 Gb/s
- Two USB 3.0/2.0 ports
- Two RS-232 or two RS-422/485 serial ports
- 3.3 V GPIO signals
XMC Site
- x8 PCI Express Gen3-capable interface
- X12d P16 I/O
Additional Features
- Non-volatile memory write protection
- Optional Trusted Platform Module (TPM)
- IEEE 1588 support on two Gigabit Ethernet ports
- Optional VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)
Software Support
- Wind River VxWorks BSP
- X-ES Enterprise Linux (XEL) BSP
- Linux Yocto BSP
- Contact factory for availability of Microsoft Windows drivers and other operating systems
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- Dimensions: 100 mm x 160 mm
- 0.8 in. pitch without solder-side cover
- 1.0 in. pitch with Two-Level Maintenance (2LM) support (optional)
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
- Conformal coating available as an ordering option
- Thermal performance will vary based on CPU frequency and application
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Accessories
- XIt1086 (90040055) – 3U VPX Rear Transition Module with PCIe, 10 Gigabit Ethernet, eSATA, USB, Serial, and Expandable XIM Sites
- XPand1007 (90075300) – Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
- XPand1203 (90072665) – 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
- XPand1205 (90075035) – 3U VPX Conduction-Cooled Development Platform
- XTend218 (90072500) – Debug Module/Cable with Serial/I²C/USB/JTAG/SPI and Power Supply Programming
XPedite7670
Intel® Xeon® D-1500 Family Processor-Based 3U VPX-REDI SBC with Dual 10 Gigabit Ethernet and an XMC Site
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Datasheet
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