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Develop with the same conduction-cooled 3U VPX payload modules that you will deploy in your ATR chassis. Software development can start right away on the ADP and your software will be running on the same hardware you will deploy. 

ADP

Avionics Development Platform

The ADP is a low-cost, flexible, 3U OpenVPX avionics system development platform. It includes standard interfaces found in avionics application, such as MIL-STD-1553, ARINC-429, MIL-STD-188-203-1A (ATDS), and 28V avionics GPIO. Complementing the I/O interfaces is a rich set of CPU options to meet any performance or power requirement. The ADP leverages COTS chassis, backplanes, power supplies, and RTMs along with conduction-cooled 3U VPX payload modules. The payload modules in the ADP are the same conduction-cooled modules that will go into the deployed avionics system.

Leveraging COTS chassis, backplanes, power supplies, and RTMs in the development platform enables software development to start quickly. In addition, the development of the deployed system custom hardware components (e.g., ATR chassis, backplane, and power supply), can be done in parallel while software development is progressing on the ADP.

The ADP is shipped with Linux, device drivers for all X-ES and third-party boards, and a full suite of tests demonstrating interface functionality. By providing an integrated, tested solution ready for immediate development, the ADP significantly reduces development schedule risk and increases the Test Readiness Level (TRL) of the final deployed system.

X-ES can perform hardware/software integration of third-party VPX and mezzanine peripherals. For the deployed solution, X-ES has ½-ATR chassis solutions, high performance backplane designs, and power supplies with hold-up power and EMI shielding from which custom system solutions can easily be derived. Please consult an X-ES sales representative to start designing your ideal Avionics Development Platform today.

  • Rapid avionics development platform
  • Utilizes conduction-cooled, deployable 3U VPX modules
  • Based on the XPand1200 chassis
  • RTM (Rear Transition Module) support for maximum I/O flexibility
  • Intel or Freescale processor-based SBCs
  • Wide variety of I/O options
  • MIL-STD-1553
  • ARINC-429
  • MIL-STD-188-203-1A (ATDS)
  • RS-232/RS-422/RS-433/RS-485
  • 10/100/1000BASE-T Ethernet
  • 10GbE (10GBASE-T) and SFP+ Optical Ethernet
  • A/D, D/A conversion
  • 28V Avionics GPIO, TTL I/O
  • Video Capture, DVI/VGA video output
  • Solid-state disk (SSD) storage
  • 110-240VAC, 50/60 Hz power input
  • Third-party PMC/XMC integration available
ADP Block Diagram

Click on the image above to view a larger version.

SBC Options

  • XPedite5170: Freescale 8640D
  • XPedite5370: Freescale 8572E
  • XPedite5470: Freescale P4080
  • XPedite5570: Freescale P2020
  • XPedite7170: Intel® Core™2 Duo
  • XPedite7370: Intel® Core™ i7

Communication Options

  • Third-party: MIL-STD-1553 PMC
  • Third-party: ARINC-492 PMC
  • Third-party: MIL-STD-188-203-1A (ATDS) PMC
  • XPort1003: RS-232/RS-422/RS-433/RS-485
  • XChange3012: 2x 10/100/1000BASE-T, 6x 1000-BASE-BX Ethernet Switch
  • XPort3000: 10GbE (10GBASE-T) and SFP+ Optical Ethernet
  • XPort9100: 28V Avionics I/O

Video/Audio Options

  • XPort4101: Component/composite video input, DVI/VGA video output
  • XPedite7370: DVI video, audio line-out

Storage Options

  • XPort6102: 80-GB SSD (XMC)
  • XPort6170 + XPort6192: 3U VPX carrier with 256-GB SATA SSD

Third-Party Mezzanine Support

  • XChange3000: XMC/PMC carrier card

Power

  • 110-240VAC, 50/60 Hz power input
  • 550 W total simultaneous power
  • Up to 50 A on 12V
  • Up to 50 A on 5V
  • Up to 25 A on 3.3V
  • ±12V_AUX
  • 3.3V_AUX

Physical Characteristics

  • Dimensions: 16.5 in. (H), 5.5 in. (W), 11.5 in. (L)
  • Weight: 20 lbs. (with backplane and power supply)