3U VPX SINGLE BOARD COMPUTER · SKU 90030765
XPedite8371
The XPedite8371 is a secure, high-performance, 3U VPX-REDI, single board computer based on the Intel® Core™ Ultra (Series 3) processor (formerly Panther Lake) and aligned to the Sensor Open System Architecture (SOSA) Payload profile (SLT3-PAY-1F1U1S1S1U1U2F1H-14.6.11) for compute-intensive applications.
Product Lifecycle
X-ES also offers comprehensive configuration and obsolescence management services, providing customers with direct control over non-interchangeable changes and extending product availability and serviceability well beyond standard end-of-life milestones.
Engineered for Extended Reliability
All X-ES products are designed and manufactured 100% in the USA with components from trusted supply chains in order to deliver rugged, reliable performance in the most demanding environments.
Built with components rated for extreme conditions and validated through rigorous testing, our solutions minimize obsolescence risk and lower total cost of ownership across the full program lifespan.
SOSA-Aligned Design
The XPedite8371 is a secure, high-performance, 3U VPX-REDI, single board computer based on the Intel® Core™ Ultra (Series 3) processor (formerly Panther Lake) and aligned to the Sensor Open System Architecture (SOSA) Payload profile (SLT3-PAY-1F1U1S1S1U1U2F1H-14.6.11) for compute-intensive applications.
Ruggedized Performance
Ideal for ruggedized systems requiring high-bandwidth processing and low power consumption, the XPedite8371 delivers superior performance and efficiency for today’s network information processing and high performance embedded computing applications.
Security & Data Protection
The XPedite8371 integrates SecureCOTS™ technology with a Microchip PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.
Memory & Storage
The XPedite8371 supports up to 64 GB of LPDDR5 SDRAM with in-band ECC in eight channels and up to 1 TB of onboard NVMe storage, with optional AES-128/256 TCG Opal 2.0 Self-Encrypting Drive (SED) support.
I/O & Connectivity
The XPedite8371 also provides fast and efficient I/O, with one 100GBASE-KR4 and two 25GBASE-KR Ethernet ports and including PCI Express through the backplane connectors.
Expansion Capabilities & Software Support
Additional expansion capabilities are available from an integrated an M.2 site and XMC site, each of which support PCI Express connections to the Intel® Core™ Ultra processor. Wind River VxWorks, X-ES Enterprise Linux (XEL), and Linux Yocto Board Support Packages (BSPs) are available.
Processor
- Supports Intel® Core™ Ultra (Series 3) processors (formerly Panther Lake)
Memory
- Up to 64 GB of LPDDR5 SDRAM with in-band ECC
- Up to 1 TB of onboard NVMe storage with optional Self-Encrypting Drive (SED) offering AES-128/256 TCG Opal 2.0 hardware encryption support
- 64 MB NOR boot flash
- 64 kB EEPROM
Security and Management
- Microchip PolarFire™ SoC FPGA with 256 MB SPI NOR flash
- Designed with SecureCOTS™ technology to support enhanced security and trusted computing
- System voltage monitor, power-on/reset control, non-volatile write-protection control
- Trusted Platform Module (TPM) 2.0
- IPMI Controller (IPMC), supporting Tier 1, Tier 2, and Tier 3 operating modes
VPX (VITA 46) P0 I/O
- Two IPMB connections to an IPMI Controller
VPX (VITA 46) P1 I/O
- One 100GBASE-KR4 Ethernet port to P1.A
- Two 25GBASE-KR Ethernet ports
- Two x4 PCI Express Gen4-capable interfaces
- Two maintenance serial ports, software configurable as LVCMOS or RS-232
- One FPGA LVDS pair
- One single-ended FPGA GPIO
Internal I/O
- One M.2 site to support one x1 PCI Express Gen4-capable interface
- One XMC site to support one x4 PCI Express Gen4-capable interface
Software Support
- RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support
- UEFI firmware
- Wind River VxWorks BSP
- X-ES Enterprise Linux (XEL) BSP
- Linux Yocto BSP
- Contact factory for availability of Microsoft Windows drivers and other operating systems
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- Supports SOSA Payload profile (SLT3-PAY-1F1U1S1S1U1U2F1H-14.6.11)
- SOSA-aligned to AMPS Payload profile MODA3-16.6.11-1-0-F2C-(E18-E15)(P4F-P4F)(E15)(G6-G2/G6)[N]<N> (compatibility with other profiles may be possible, contact factory for options)
- Dimensions: 100 mm x 160 mm
- 1.0 in. pitch with Two-Level Maintenance (2LM) support
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
- Conformal coating available as an ordering option
- Thermal performance will vary based on CPU frequency and application
- Contact X-ES for air-cooled development options
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Accessories
- XIt1103 (90040155) – 3U VPX Rear Transition Module with 100/25 Gigabit Ethernet and Serial
- XTend4943 (90020240) – 3U VPX Development Backplane
XPedite8371
Intel® Core™ Ultra (Series 3) Processor-Based 3U VPX-REDI Module with 64 GB of LPDDR5 and Microchip PolarFire™ SoC FPGA
Connect with a product expert today
Access technical documentation, board support packages, software, and other resources for working with the XPedite8371. All X-ES products are backed by our four-hour customer support guarantee.
Datasheet
To view all of the information about this product in a PDF, please download the datasheet.
Technical Documentation
SupportNet is your source for hardware manuals, technical support, and software downloads.
Intel® Core™ Ultra (Series 3) Overview
Learn more about the Intel® Core™ Ultra (Series 3) family of processors.
