Products
Overview
Showing 181–195 of 358 results
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XPand1400 Series
Form Factor: COM Express®, PCIe Edge Card, PMC, XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 21.5"L x 9"W x 20.5"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform For XPand6000 Series, X-ES COM Express® Modules, and XMC/PMC Modules
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XTend2001
Status: End of Life (EOL)
Form Factor: XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 6.55"L x 3.95"W x 0.83"H
Chassis Cooling: Forced Convection-CooledDual-XMC Carrier for Development and Testing
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XPand1205
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
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XPand1203
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
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XPand1015
Form Factor: 6U VPX
Chassis Type: Development
Number of Slots: 2
Dimensions: 17.5"L x 5.6"W x 9.3"H
Chassis Cooling: Conduction-CooledTwo-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
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XPedite2870
Form Factor: 3U VPX
Processor: AMD (formerly Xilinx) Versal® Gen 2 AI Edge
Alternates: AMD (formerly Xilinx) Versal® Gen 2 Prime
Memory: 32 GB LPDDR5x
Ethernet: 2 10/100/1000BASE-T
Serial: 5 High-Speed Serial, 1 RS-232, 1 RS-232/422/485
LVDS I/O: 8
Single-Ended I/O: 19
SOSA Support: I/O IntensiveAMD (formerly Xilinx) Versal® Gen 2 ASoC-Based 3U VPX Module with 32 GB of LPDDR5x, PCIe Gen5, and SecureCOTS™
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XPedite2770
Form Factor: 3U VPX
Processor: AMD (formerly Xilinx) Versal® Prime VM1402 ACAP
Memory: 16 GB LPDDR4
Ethernet: 2 1000BASE-T
Serial: 6 High-Speed Serial, 1 RS-232/422/485
LVDS I/O: 14
Single-Ended I/O: 19
SOSA Support: I/O IntensiveAMD (formerly Xilinx) Versal® Prime VM1402 ACAP-Based 3U VPX Module with 16 GB of LPDDR4, PCIe Gen3, and SecureCOTS™
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XPedite2600
Form Factor: XMC
Processor: AMD (formerly Xilinx) Zynq® UltraScale+™ XCZU11EG
Memory: 16 GB DDR4
Ethernet: 1 10/100/1000BASE-T, 2 1000BASE-X
USB: 2 USB 2.0
Serial: 8 High-Speed Serial, 2 RS-232/422/485
LVDS I/O: 41 PairsAMD (formerly Xilinx) Zynq® UltraScale+™ MPSoC-Based Conduction- or Air-Cooled XMC Module
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XPedite2570
Form Factor: 3U VPX
Processor: AMD (formerly Xilinx) Kintex® UltraScale™ XCKU115
Memory: 8 GB DDR4
Serial: 2 High-Speed Serial
LVDS I/O: 44 Pairs
Single-Ended I/O: 10
Optical Transmitters: 12
Optical Receivers: 123U VPX AMD (formerly Xilinx) Kintex® UltraScale™ FPGA-Based Fiber-Optic I/O Module
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XPedite2500
Form Factor: XMC
Processor: AMD (formerly Xilinx) Kintex® UltraScale™ XCKU115
Memory: 8 GB DDR4
Serial: 8 High-Speed Serial
LVDS I/O: 45 PairsAMD (formerly Xilinx) Kintex® UltraScale™ FPGA-Based Conduction- or Air-Cooled XMC Module
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XCalibur5090
Form Factor: 6U LRM
Processor: AMD (formerly Xilinx) Virtex-7
Memory: 1 GB DDR3
Serial: 1 High-Speed Serial
Single-Ended I/O: 96
ADC Input Channels: 4
DAC Output Channels: 4Dual Virtex-7 Based Digital Signal Processing 6U LRM FPGA with Quad 2500 MSPS DAC and 3200 MSPS ADC



